PCB 专业英译术语大全：精准规范行业核心词汇

一、综合核心术语

1. 印制电路：printed circuit
2. 印制线路：printed wiring
3. 印制板：printed board
4. 印制电路板：printed circuit board (PCB)
5. 印制线路板：printed wiring board (PWB)
6. 印制组件：printed component
7. 印制接点：printed contact
8. 印制板装配：printed board assembly
9. 板：board
10. 单面印制板：single-sided printed board (SSB)
11. 双面印制板：double-sided printed board (DSB)
12. 多层印制板：multilayer printed board (MLB)
13. 多层印制电路板：multilayer printed circuit board
14. 多层印制线路板：multilayer printed wiring board
15. 刚性印制板：rigid printed board
16. 刚性单面印制板：rigid single-sided printed board
17. 刚性双面印制板：rigid double-sided printed board
18. 刚性多层印制板：rigid multilayer printed board
19. 挠性多层印制板：flexible multilayer printed board
20. 挠性印制板：flexible printed board
21. 挠性单面印制板：flexible single-sided printed board
22. 挠性双面印制板：flexible double-sided printed board
23. 挠性印制电路：flexible printed circuit (FPC)
24. 挠性印制线路：flexible printed wiring
25. 刚柔结合印制板：flex-rigid printed board, rigid-flex printed board
26. 刚柔结合双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed board
27. 刚柔结合多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28. 齐平印制板：flush printed board
29. 金属芯印制板：metal core printed board
30. 金属基印制板：metal base printed board
31. 多重布线印制板：multi-wiring printed board
32. 陶瓷印制板：ceramic substrate printed board
33. 导电胶印制板：electroconductive paste printed board
34. 模塑电路板：molded circuit board
35. 模压印制板：stamped printed wiring board
36. 顺序层压多层印制板：sequentially-laminated multilayer
37. 散线印制板：discrete wiring board
38. 微线印制板：micro wire board
39. 积层印制板：build-up printed board
40. 积层多层印制板：build-up multilayer printed board (BUM)
41. 积层挠印制板：build-up flexible printed board
42. 表面层合电路板：surface laminar circuit (SLC)
43. 埋入凸块连印制板：B2it printed board
44. 多层膜基板：multi-layered film substrate (MFS)
45. 层间全内导通多层印制板：ALIVH multilayer printed board
46. 载芯片板：chip on board (COB)
47. 埋电阻板：buried resistance board
48. 母板：mother board
49. 子板：daughter board
50. 背板：backplane
51. 裸板：bare board
52. 键盘板夹心板：copper-invar-copper board
53. 动态挠性板：dynamic flex board
54. 静态挠性板：static flex board
55. 可断拼板：break-away panel
56. 电缆：cable
57. 挠性扁平电缆：flexible flat cable (FFC)
58. 薄膜开关：membrane switch
59. 混合电路：hybrid circuit
60. 厚膜：thick film
61. 厚膜电路：thick film circuit
62. 薄膜：thin film
63. 薄膜混合电路：thin film hybrid circuit
64. 互连：interconnection
65. 导线：conductor trace line
66. 齐平导线：flush conductor
67. 传输线：transmission line
68. 跨交：crossover
69. 板边插头：edge-board contact
70. 增强板：stiffener
71. 基底：substrate
72. 基板面：real estate
73. 导线面：conductor side
74. 组件面：component side
75. 焊接面：solder side
76. 印制：printing
77. 网格：grid
78. 图形：pattern
79. 导电图形：conductive pattern
80. 非导电图形：non-conductive pattern
81. 字符：legend
82. 标志：mark

二、基材相关术语

1. 基材：base material
2. 层压板：laminate
3. 覆金属箔基材：metal-clad base material
4. 覆铜箔层压板：copper-clad laminate (CCL)
5. 单面覆铜箔层压板：single-sided copper-clad laminate
6. 双面覆铜箔层压板：double-sided copper-clad laminate
7. 复合层压板：composite laminate
8. 薄层压板：thin laminate
9. 金属芯覆铜箔层压板：metal core copper-clad laminate
10. 金属基覆铜层压板：metal base copper-clad laminate
11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12. 基体材料：basis material
13. 预浸材料：prepreg
14. 粘结片：bonding sheet
15. 预浸粘结片：preimpregnated bonding sheet
16. 环氧玻璃基板：epoxy glass substrate
17. 加成法用层压板：laminate for additive process
18. 预制内层覆箔板：mass lamination panel
19. 内层芯板：core material
20. 催化板材：catalyzed board, coated catalyzed laminate
21. 涂胶催化层压板：adhesive-coated catalyzed laminate
22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate
23. 粘结层：bonding layer
24. 粘结膜：film adhesive
25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26. 无支撑胶粘剂膜：unsupported adhesive film
27. 覆盖层：cover layer (cover lay)
28. 增强板材：stiffener material
29. 铜箔面：copper-clad surface
30. 去铜箔面：foil removal surface
31. 层压板面：unclad laminate surface
32. 基膜面：base film surface
33. 胶粘剂面：adhesive face
34. 原始光洁面：plate finish
35. 粗面：matt finish
36. 纵向：length wise direction
37. 横向：cross wise direction
38. 剪切板：cut to size panel
39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates (phenolic/paper CCL)
40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44. 聚酯玻璃布覆铜箔板：polyester woven glass fabric copper-clad laminates
45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad laminates
47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48. 聚四氟乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49. 超薄型层压板：ultra thin laminate
50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates
51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

三、总结